KUALA LUMPUR: Worldwide semiconductor manufacturing equipment billings surged 240% year-on-year (y-o-y) in the second quarter of 2010 to US$9.11 billion (RM28.3 billion), said SEMI, the global industry association for companies that supply manufacturing technology and materials to the world's chip makers.
In a statement on its website on Sept 8, SEMI said the 2Q billings were 22% higher than the first quarter billings this year.
Meanwhile, worldwide semiconductor equipment bookings were US$11.68 billion in the second quarter of 2010, said SEMI.
The figure is 296% more than the same quarter a year ago and 24% greater than the bookings figure for the first quarter of 2010, it said.
The data is gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 100 global equipment companies that provide data on a monthly basis.
In a statement on its website on Sept 8, SEMI said the 2Q billings were 22% higher than the first quarter billings this year.
Meanwhile, worldwide semiconductor equipment bookings were US$11.68 billion in the second quarter of 2010, said SEMI.
The figure is 296% more than the same quarter a year ago and 24% greater than the bookings figure for the first quarter of 2010, it said.
The data is gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 100 global equipment companies that provide data on a monthly basis.
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