KUALA LUMPUR: Global semiconductor materials sales in 2010 jumped 25% year-on-year (y-o-y) to US$43.55 billion from US$34.84 billion a year earlier, driven mainly by record device shipments, according to the Semiconductor Equipment Manufacturers Industry Association (SEMI).
US-based SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries.
In a statement on its website on March 28, record device shipments were primarily responsible for the record revenues experienced by the materials industry, surpassing the previous high of US$42.67 billion set in 2007.
Total wafer fabrication materials and packaging materials were US$22.93 billion and US$20.63 billion last year, respectively, it said.
SEMI said comparable revenues for these segments in 2009 were US$17.75 billion for wafer fabrication materials and US$17.09 billion for packaging materials.
Significant increases in silicon and advanced packaging substrates revenues contributed to the year-over-year growth of the total semiconductor materials market, it said.
Meanwhile, it said Japan remained the largest consumer of semiconductor materials with US$9.20 billion in total sales, though the materials market in Taiwan reached US$9.11 billion due to its large foundry and advanced packaging base.
'All regional markets experienced double-digit growth.
'Rising gold metal prices propelled revenues in regions with strong packaging bases,' said SEMI.
US-based SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries.
In a statement on its website on March 28, record device shipments were primarily responsible for the record revenues experienced by the materials industry, surpassing the previous high of US$42.67 billion set in 2007.
Total wafer fabrication materials and packaging materials were US$22.93 billion and US$20.63 billion last year, respectively, it said.
SEMI said comparable revenues for these segments in 2009 were US$17.75 billion for wafer fabrication materials and US$17.09 billion for packaging materials.
Significant increases in silicon and advanced packaging substrates revenues contributed to the year-over-year growth of the total semiconductor materials market, it said.
Meanwhile, it said Japan remained the largest consumer of semiconductor materials with US$9.20 billion in total sales, though the materials market in Taiwan reached US$9.11 billion due to its large foundry and advanced packaging base.
'All regional markets experienced double-digit growth.
'Rising gold metal prices propelled revenues in regions with strong packaging bases,' said SEMI.
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