Thursday, December 15, 2011

SEMI: Semicon packaging materials market to hit US$25.7b by 2015

KUALA LUMPUR (Dec 15): The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $22.8 billion in 2011 and grow to US$25.7 billion by 2015.

A new study by the US-based Semiconductor Equipment Manufacturers Industry association (SEMI) and TechSearch International released on Dec 14 said that laminate substrates remain the largest segment of the market, worth an estimated US$9.7 billion globally in 2011, and on a unit basis were projected to grow at a compound annual growth rate of eight percent over the next five years.

The report, titled 'Global Semiconductor Packaging Materials Outlook: 2011/2012 Edition,' covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials.

Several areas are experiencing stronger growth as new material ramp up in production in packaging, including underfill materials, wafer-level dielectrics, copper bonding, leadframe CSP, and others, said the report.

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